Influence of initial current density on bonding strength between Ni layer and Cu substrate in microelectroforming
Shao, Ligeng, Wang, Liding, Du, LiqunVolume:
30
Language:
english
Journal:
Journal of Adhesion Science and Technology
DOI:
10.1080/01694243.2016.1173391
Date:
September, 2016
File:
PDF, 1.60 MB
english, 2016