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[IEEE 2009 IEEE International Conference on 3D System Integration (3DIC) - San Francisco, CA, USA (2009.09.28-2009.09.30)] 2009 IEEE International Conference on 3D System Integration - Thin wafer handling — Study of temporary wafer bonding materials and processes
Hermanowski, JamesYear:
2009
Language:
english
DOI:
10.1109/3DIC.2009.5306550
File:
PDF, 445 KB
english, 2009