[IEEE 2016 17th International Conference on Thermal,...

[IEEE 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Montpellier, France (2016.4.18-2016.4.20)] 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Simulating moisture diffusion in polymers using thermal-moisture analogy

Sasi, Arun, Gromala, Przemyslaw

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Year:

2016

Language:

english

DOI:

10.1109/EuroSimE.2016.7463372

File:

PDF, 515 KB

english, 2016

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