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[IEEE 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Montpellier, France (2016.4.18-2016.4.20)] 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Simulating moisture diffusion in polymers using thermal-moisture analogy
Sasi, Arun, Gromala, PrzemyslawYear:
2016
Language:
english
DOI:
10.1109/EuroSimE.2016.7463372
File:
PDF, 515 KB
english, 2016