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[IEEE 2016 IEEE International Solid-State Circuits Conference (ISSCC) - San Francisco, CA, USA (2016.1.31-2016.2.4)] 2016 IEEE International Solid-State Circuits Conference (ISSCC) - 11.2 3D ultrasonic fingerprint sensor-on-a-chip
Tang, Hao-Yen, Lu, Yipeng, Assaderagh, Fari, Daneman, Mike, Jiang, Xiaoyue, Lim, Martin, Li, Xi, Ng, Eldwin, Singhal, Utkarsh, Tsai, Julius M., Horsley, David A., Boser, Bernhard E.Year:
2016
Language:
english
DOI:
10.1109/ISSCC.2016.7417977
File:
PDF, 3.34 MB
english, 2016