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[IEEE 2015 IEEE International Electron Devices Meeting (IEDM) - Washington, DC, USA (2015.12.7-2015.12.9)] 2015 IEEE International Electron Devices Meeting (IEDM) - Low-cost and TSV-free monolithic 3D-IC with heterogeneous integration of logic, memory and sensor analogy circuitry for Internet of Things
Wu, Tsung-Ta, Shen, Chang-Hong, Shieh, Jia-Min, Huang, Wen-Hsien, Wang, Hsing-Hsiang, Hsueh, Fu-Kuo, Chen, Hisu-Chih, Yang, Chih-Chao, Hsieh, Tung-Ying, Chen, Bo-Yuan, Shiao, Yu-Shao, Yang, Chao-Shun,Year:
2015
Language:
english
DOI:
10.1109/IEDM.2015.7409765
File:
PDF, 1.38 MB
english, 2015