Thermal-Aware Task Scheduling for 3D-Network-on-Chip: A Bottom to Top Scheme
Cui, Yingnan, Zhang, Wei, Chaturvedi, Vivek, Liu, Weichen, He, BingshengVolume:
25
Language:
english
Journal:
Journal of Circuits, Systems and Computers
DOI:
10.1142/S021812661640003X
Date:
January, 2016
File:
PDF, 503 KB
english, 2016