Mechanical stress investigation after technological process...

Microelectronics Reliability 2015 / 08 Vol. 55; Iss. 9-10

Mechanical stress investigation after technological process in Deep Trench Termination DT2 using BenzoCycloButene as dielectric material

Arbess, H., Baccar, F., Theolier, L., Azzopardi, S., Woirgard, E.
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
55
Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2015.07.019
Date:
August, 2015
File:
PDF, 1.18 MB
english, 2015
Conversion to is in progress
Conversion to is failed