The investigation of interfacial and crystallographic observation in the Ni(V)/SAC/OSP Cu solder joints with high and low silver content during thermal cycling test
Lee, Christine Jill, Chen, Wei-Yu, Chou, Tzu-Ting, Lee, Tae-Kyu, Wu, Yew-Chung, Chang, Tao-Chih, Duh, Jenq-GongVolume:
26
Language:
english
Journal:
Journal of Materials Science: Materials in Electronics
DOI:
10.1007/s10854-015-3687-7
Date:
December, 2015
File:
PDF, 4.68 MB
english, 2015