Whisker growth on SnAgCu–xPr solders in electronic...

Journal of Materials Science: Materials in Electronics 2016 / 6 Vol. 27; Iss. 6

Whisker growth on SnAgCu–xPr solders in electronic packaging

Zhang, Liang, Yang, Fan, Zhong, Su-juan
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Volume:
27
Language:
english
Journal:
Journal of Materials Science: Materials in Electronics
DOI:
10.1007/s10854-016-4468-7
Date:
June, 2016
File:
PDF, 655 KB
english, 2016
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