Effect of nano-Al addition on properties and microstructure of low-Ag content Sn–1Ag–0.5Cu solders
Sun, Lei, Zhang, Liang, Xu, Le, Zhong, Su-Juan, Ma, Jia, Bao, LiLanguage:
english
Journal:
Journal of Materials Science: Materials in Electronics
DOI:
10.1007/s10854-016-4751-7
Date:
April, 2016
File:
PDF, 2.42 MB
english, 2016