Influence of polyimide on thermal stress evolution in polyimide/Cu thick film composite
Li, Heng, Cheng, Gong, Xu, Gaowei, Luo, LeLanguage:
english
Journal:
Journal of Materials Science: Materials in Electronics
DOI:
10.1007/s10854-016-4841-6
Date:
April, 2016
File:
PDF, 1004 KB
english, 2016