Fatigue Characterization for Flexible Circuit with Polyimide on Adhesiveless Copper
Huang, Kuo-Hua, Duh, Jenq-GongVolume:
44
Language:
english
Journal:
Journal of Electronic Materials
DOI:
10.1007/s11664-015-3865-7
Date:
October, 2015
File:
PDF, 2.15 MB
english, 2015