A Novel Conditional Probability Density Distribution Surface for the Analysis of the Drop Life of Solder Joints Under Board Level Drop Impact
Gu, Jian, Lei, YongPing, Lin, Jian, Fu, HanGuang, Wu, ZhongweiVolume:
45
Language:
english
Journal:
Journal of Electronic Materials
DOI:
10.1007/s11664-015-4012-1
Date:
January, 2016
File:
PDF, 1.90 MB
english, 2016