Wafer level package of Au-Ge system using a Ge chemical...

Applied Surface Science 2016 / 11 Vol. 385

Wafer level package of Au-Ge system using a Ge chemical vapor deposition (CVD) thin film

Choi, Kyeong-Keun, Hosseini, Nazanin, Kee, Jong, Kim, Sung-Kyu, Park, Chan-Gyung
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Volume:
385
Language:
english
Journal:
Applied Surface Science
DOI:
10.1016/j.apsusc.2016.05.081
Date:
November, 2016
File:
PDF, 2.66 MB
english, 2016
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