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Effect of adhesive fillet geometry on bond strength between microelectronic components and composite circuit boards
Akbari, Saeed, Nourani, Amir, Spelt, Jan K.Volume:
87
Language:
english
Journal:
Composites Part A: Applied Science and Manufacturing
DOI:
10.1016/j.compositesa.2016.04.027
Date:
August, 2016
File:
PDF, 2.76 MB
english, 2016