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Advanced Characterization of thermo-mechanical fatigue mechanisms of different copper film systems for wafer metallizations
Bigl, Stephan, Wurster, Stefan, Cordill, Megan J., Kiener, DanielLanguage:
english
Journal:
Thin Solid Films
DOI:
10.1016/j.tsf.2016.05.044
Date:
May, 2016
File:
PDF, 2.99 MB
english, 2016