[IEEE 2009 IEEE International Conference on 3D System Integration (3DIC) - San Francisco, CA, USA (2009.09.28-2009.09.30)] 2009 IEEE International Conference on 3D System Integration - Wafer-scale 3D integration of InGaAs image sensors with Si readout circuits
Chen, C.L., Yost, D-R., Knecht, J.M., Chapman, D.C., Oakley, D.C., Mahoney, L.J., Donnelly, J.P., Soares, A.M., Suntharalingam, V., Berger, R., Bolkhovsky, V., Hu, W., Wheeler, B.D., Keast, C.L., ShavYear:
2009
Language:
english
DOI:
10.1109/3dic.2009.5306556
File:
PDF, 342 KB
english, 2009