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[IEEE 2013 IEEE International 3D Systems Integration Conference (3DIC) - San Francisco, CA, USA (2013.10.2-2013.10.4)] 2013 IEEE International 3D Systems Integration Conference (3DIC) - Cost-effective temporary bonding and debonding material solution towards high-volume manufacturing 2.5D/3D through-silicon via integrated circuits
Civale, Yann, Meynen, Herman, John, Ranjith S. E., Fu, Peng-Fei, Yeakle, Craig R., Wang, Sheng, Krausse, Stefan, Rapps, Thomas, Lutter, StefanYear:
2013
Language:
english
DOI:
10.1109/3dic.2013.6702330
File:
PDF, 530 KB
english, 2013