[IEEE 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) - Singapore (2015.12.2-2015.12.4)] 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) - Development of high reliability lead-free solder joint dispersed IMC pillar
Hayashi, Yawara, Shohji, Ikuo, Nakata, Yusuke, Hashimoto, TomihitoYear:
2015
Language:
english
DOI:
10.1109/eptc.2015.7412284
File:
PDF, 890 KB
english, 2015