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[IEEE 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Montpellier, France (2016.4.18-2016.4.20)] 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Thermal design of integrated heating for lab-on-a-chip systems
Streit, Petra, Nestler, Joerg, Shaporin, Alexey, Schulze, Robert, Gessner, ThomasYear:
2016
Language:
english
DOI:
10.1109/eurosime.2016.7463308
File:
PDF, 1.49 MB
english, 2016