[IEEE 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IAAC) - Kyoto, Japan (2015.4.14-2015.4.17)] 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IAAC) - Stress and strain analysis using multi-physics solver for power device heat dissipation structures under thermal cycling test
Asai, Takahiro, Aoki, Masaaki, Mochizuki, Akihiro, Honjo, Takamitsu, Kida, Hitoshi, Yoshinari, Goro, Nakano, NobuhikoYear:
2015
Language:
english
DOI:
10.1109/icep-iaac.2015.7111124
File:
PDF, 3.05 MB
english, 2015