[IEEE 2016 International Conference on Microelectronic Test Structures (ICMTS) - Yokohama, Japan (2016.3.28-2016.3.31)] 2016 International Conference on Microelectronic Test Structures (ICMTS) - Design and use of an array-based test structure to characterize mechanical stress effects caused by WLCSP solder bumps
Tuinhout, Hans, van Dalen, RobYear:
2016
Language:
english
DOI:
10.1109/icmts.2016.7476175
File:
PDF, 42.70 MB
english, 2016