![](/img/cover-not-exists.png)
[IEEE 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2015.10.21-2015.10.23)] 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Advanced materials with low dielectric constant and low coefficient of thermal expansion
Kuei-Yi Chuang,, Kuo-Chan Chiou,, Feng-Po Tseng,Year:
2015
Language:
english
DOI:
10.1109/impact.2015.7365239
File:
PDF, 1.11 MB
english, 2015