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[IEEE 2014 Joint IEEE International Symposium on the Applications of Ferroelectrics, International Workshop on Acoustic Transduction Materials and Devices & Workshop on Piezoresponse Force Microscopy (ISAF/IWATMD/PFM) - State College, PA, USA (2014.5.12-2014.5.16)] 2014 Joint IEEE International Symposium on the Applications of Ferroelectric, International Workshop on Acoustic Transduction Materials and Devices & Workshop on Piezoresponse Force Microscopy - The influence of the solder joint void on the CCGA package reliability
Huang, Yingzhuo, Lian, Binhao, Yao, Quanbin, Lv, Xiaorui, Lin, PengrongYear:
2014
Language:
english
DOI:
10.1109/isaf.2014.6917990
File:
PDF, 495 KB
english, 2014