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Creation of Vias With Optimized Profile for 3-D Through Silicon Interconnects (TSV)
Karola Richter, Kay Viehweger, Jian He, Johann-Wolfgang BarthaVolume:
6
Year:
2009
Language:
english
Pages:
1
DOI:
10.1002/ppap.200930501
File:
PDF, 378 KB
english, 2009