An Ultracompact TSV-Based Common-Mode Filter (TSV-CMF) in...

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IEEE Transactions on Electromagnetic Compatibility 2016

An Ultracompact TSV-Based Common-Mode Filter (TSV-CMF) in Three-Dimensional Integrated Circuits (3-D ICs)

Cheng, Chi-Hsuan, Wu, Tzong-Lin
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Year:
2016
Language:
english
Journal:
IEEE Transactions on Electromagnetic Compatibility
DOI:
10.1109/temc.2016.2543246
File:
PDF, 871 KB
english, 2016
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