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Effect of Under-Layer Treatment of Ta/TaN Barrier Film on Corrosion Between Cu Seed and Ta in Chemical-Mechanical-Polishing Slurry
Lee, Wen-Hsi, Hung, Chi-Cheng, Wang, Yu-Sheng, Chang, Shih-Chieh, Wang, Ying-LangVolume:
10
Language:
english
Journal:
Journal of Nanoscience and Nanotechnology
DOI:
10.1166/jnn.2010.2448
Date:
July, 2010
File:
PDF, 2.10 MB
english, 2010