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Solidification of Sn-3Ag-0.5Cu and Sn-0.7Cu-0.05Ni Solders
Gourlay, C.M., Ma, Zhao Long, Xian, Jing Wei, Belyakov, Sergey A., Mohd Salleh, Mohd Arif Anuar, Zeng, Guang, Yasuda, Hideyuki, Nogita, KazuhiroVolume:
857
Language:
english
Journal:
Materials Science Forum
DOI:
10.4028/www.scientific.net/MSF.857.44
Date:
May, 2016
File:
PDF, 2.54 MB
english, 2016