Solidification of Sn-3Ag-0.5Cu and Sn-0.7Cu-0.05Ni Solders

Gourlay, C.M., Ma, Zhao Long, Xian, Jing Wei, Belyakov, Sergey A., Mohd Salleh, Mohd Arif Anuar, Zeng, Guang, Yasuda, Hideyuki, Nogita, Kazuhiro

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Volume:

857

Language:

english

Journal:

Materials Science Forum

DOI:

10.4028/www.scientific.net/MSF.857.44

Date:

May, 2016

File:

PDF, 2.54 MB

english, 2016

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