History and Recent Developments of Packaging Technology for...

Materials Science Forum 2016 / 5 Vol. 858

History and Recent Developments of Packaging Technology for SiC Power Devices

Dohnke, Karl Otto, Guth, Karsten, Heuck, Nicolas
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Volume:
858
Language:
english
Journal:
Materials Science Forum
DOI:
10.4028/www.scientific.net/msf.858.1043
Date:
May, 2016
File:
PDF, 3.87 MB
english, 2016
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