Investigation on the Microstructure, Interfacial IMC Layer, and Mechanical Properties of Cu/Sn-0.7Cu-xNi/Cu Solder Joints
Yang, Li, Ge, Jinguo, Zhang, Yaocheng, Dai, Jun, Liu, Haixiang, Xiang, JicenVolume:
45
Language:
english
Journal:
Journal of Electronic Materials
DOI:
10.1007/s11664-016-4509-2
Date:
July, 2016
File:
PDF, 3.88 MB
english, 2016