[IEEE 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Montpellier, France (2016.4.18-2016.4.20)] 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - State of the art of numerical thermal characterization of electronic component
Monier-Vinard, Eric, Rogie, Brice, Bissuel, Valentin, Laraqi, Najib, Daniel, Olivier, Kotelon, Marie-CecileYear:
2016
Language:
english
DOI:
10.1109/eurosime.2016.7463296
File:
PDF, 928 KB
english, 2016