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SPIE Proceedings [SPIE SPIE Commercial + Scientific Sensing and Imaging - Baltimore, Maryland, United States (Sunday 17 April 2016)] Sensing and Analysis Technologies for Biomedical and Cognitive Applications 2016 - 3D MEMS sensor for application on earthquakes early detection and Nowcast

Dai, Liyi, Zheng, Yufeng, Chu, Henry, Meyer-Bäse, Anke D., Wu, Jerry, Liang, Jing, Szu, Harold
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Volume:
9871
Year:
2016
Language:
english
DOI:
10.1117/12.2239983
File:
PDF, 824 KB
english, 2016
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