[IEEE 2016 International Conference on Electronics Packaging (ICEP) - Hokkaido, Japan (2016.4.20-2016.4.22)] 2016 International Conference on Electronics Packaging (ICEP) - An overview of the Photonics Systems Manufacturing Consortium - A participant in the americal institute for manufacturing-integrated photonics institute
Otte, Richard F., Pfahl, Robert, Kimerling, Lionel, Bottoms, Bill, MacWilliams, John, Grzybowski, Rich, Kirchain, Randolph, Olivetti, ElsaYear:
2016
Language:
english
DOI:
10.1109/ICEP.2016.7486788
File:
PDF, 260 KB
english, 2016