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Heat generation and distribution in the ultrasonic hot embossing process
Kosloh, J., Sackmann, J., Šakalys, R., Liao, S., Gerhardy, C., Schomburg, W. K.Language:
english
Journal:
Microsystem Technologies
DOI:
10.1007/s00542-016-2836-0
Date:
January, 2016
File:
PDF, 1.59 MB
english, 2016