Three-dimensional multi-layer through-hole filling properties of solderable polymer composites with low-melting-point alloy fillers
Lee, Jeong Il, Yim, Byung-Seung, Shin, Dongjun, Kim, Jong-MinVolume:
27
Language:
english
Journal:
Journal of Materials Science: Materials in Electronics
DOI:
10.1007/s10854-016-4553-y
Date:
June, 2016
File:
PDF, 3.07 MB
english, 2016