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Drop Reliability of Epoxy-contained Sn-58 wt.%Bi Solder...

Drop Reliability of Epoxy-contained Sn-58 wt.%Bi Solder Joint with ENIG and ENEPIG Surface Finish Under Temperature and Humidity Test

Myung, Woo-Ram, Kim, Yongil, Kim, Kyung-Yeol, Jung, Seung-Boo
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Volume:
45
Language:
english
Journal:
Journal of Electronic Materials
DOI:
10.1007/s11664-016-4517-2
Date:
July, 2016
File:
PDF, 1.98 MB
english, 2016
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