B12-O-02Observation of Dominant Diffusion Path of Copper in the Electrically Biased Interconnects using in-situ TEM
Oh, Young-Hwa, Lee, Seung-Yong, Ahn, Tae-Young, Kim, Miyoung, Kim, Young-WoonVolume:
64
Language:
english
Journal:
Microscopy
DOI:
10.1093/jmicro/dfv089
Date:
November, 2015
File:
PDF, 631 KB
english, 2015