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[IEEE 2013 IEEE International 3D Systems Integration Conference (3DIC) - San Francisco, CA, USA (2013.10.2-2013.10.4)] 2013 IEEE International 3D Systems Integration Conference (3DIC) - Recent progress in thin wafer processing
Uhrmann, Thomas, Matthias, Thorsten, Wimplinger, Markus, Burggraf, Jurgen, Burgstaller, Daniel, Wiesbauer, Harald, Lindner, PaulYear:
2013
Language:
english
DOI:
10.1109/3dic.2013.6702341
File:
PDF, 1.02 MB
english, 2013