![](/img/cover-not-exists.png)
[IEEE 2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) - Cannes, France (2014.4.1-2014.4.4)] 2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) - Bond strength of conductive Si-Si fusion bonded seals
Schjolberg-Henriksen, Kari, Tvedt, Lars Geir Whist, Moe, Sigurd, Poppe, Erik, Wang, Dag, Gjelstad, Stein Are, Mork, Christopher, Imenes, KristinYear:
2014
Language:
english
DOI:
10.1109/dtip.2014.7056638
File:
PDF, 523 KB
english, 2014