[IEEE 2014 Symposium on Design, Test, Integration and...

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[IEEE 2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) - Cannes, France (2014.4.1-2014.4.4)] 2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) - Bond strength of conductive Si-Si fusion bonded seals

Schjolberg-Henriksen, Kari, Tvedt, Lars Geir Whist, Moe, Sigurd, Poppe, Erik, Wang, Dag, Gjelstad, Stein Are, Mork, Christopher, Imenes, Kristin
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Year:
2014
Language:
english
DOI:
10.1109/dtip.2014.7056638
File:
PDF, 523 KB
english, 2014
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