Spectroscopic ellipsometry study of thin diffusion barriers...

physica status solidi (a) 2008 Vol. 205; Iss. 4

Spectroscopic ellipsometry study of thin diffusion barriers of TaN and Ta for Cu interconnects in integrated circuits

S. Rudra, T. Wächtler, M. Friedrich, S. J. Louis, C. Himcinschi, S. Zimmermann, S. E. Schulz, S. Silaghi, C. Cobet, N. Esser, T. Gessner, D. R. T. Zahn
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Volume:
205
Year:
2008
Language:
english
Pages:
5
DOI:
10.1002/pssa.200777831
File:
PDF, 439 KB
english, 2008
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