[IEEE 2005 European Microwave Conference - Paris, France (2005.10.4-2005.10.6)] 2005 European Microwave Conference - A 3D wideband package solution using MCM-D BCB technology for tile TR module
Barbier, T., Mazel, F., Reig, B., Monfraix, P.Year:
2005
Language:
english
DOI:
10.1109/eumc.2005.1610234
File:
PDF, 401 KB
english, 2005