Time-Efficient Curing of Printed Dielectrics via Infra-Red...

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IEEE Transactions on Electron Devices 2016

Time-Efficient Curing of Printed Dielectrics via Infra-Red Suitable to S2S and R2R Manufacturing Platforms for Electronic Devices

Mitra, Kalyan Yoti, Weise, Dana, Hartwig, Melinda, Kapadia, Sunil, Baumann, Reinhard R.
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Year:
2016
Language:
english
Journal:
IEEE Transactions on Electron Devices
DOI:
10.1109/ted.2016.2560945
File:
PDF, 1.83 MB
english, 2016
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