Experimental study on the effect of wire bonding by Cu...

physica status solidi (a) 2011 Vol. 208; Iss. 3

Experimental study on the effect of wire bonding by Cu electroplating on GMI stability of Co-based amorphous wires

Jing-Shun Liu, Jian-Fei Sun, Da-Wei Xing, Xiang Xue, Shu-Ling Zhang, Huan Wang, Xiao-Dong Wang
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
208
Year:
2011
Language:
english
Pages:
5
DOI:
10.1002/pssa.201026351
File:
PDF, 474 KB
english, 2011
Conversion to is in progress
Conversion to is failed