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Front Cover: Experimental study on the effect of wire bonding by Cu electroplating on GMI stability of Co-based amorphous wires (Phys. Status Solidi A 3/2011)
Jing-Shun Liu, Jian-Fei Sun, Da-Wei Xing, Xiang Xue, Shu-Ling Zhang, Huan Wang, Xiao-Dong WangVolume:
208
Year:
2011
Pages:
1
DOI:
10.1002/pssa.201190007
File:
PDF, 164 KB
2011