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Enhancing Chemical Stability of Electroplated Cu Films by Engineering Electrolyte Chemistry and Twinning Structure
Yang, Chih-Jie, Huang, Chun-Lung, Liao, Chien-NengVolume:
44
Language:
english
Journal:
Journal of Electronic Materials
DOI:
10.1007/s11664-015-3839-9
Date:
July, 2015
File:
PDF, 1.36 MB
english, 2015