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Effects of Fe and Bi Minor Alloying on Mechanical, Thermal, and Microstructural Properties of Sn-0.7Cu Solder Alloy
Mahdavifard, M. H., Sabri, M. F. M., Said, S. M., Shnawah, D. A., Badruddin, I. A., Rozali, S.Volume:
45
Language:
english
Journal:
Journal of Electronic Materials
DOI:
10.1007/s11664-016-4521-6
Date:
July, 2016
File:
PDF, 3.71 MB
english, 2016