A feasible ultrafine grained Cu matrix composite microstructure for achieving high strength and high electrical conductivity
Zhou, Dengshan, Zeng, Wei, Zhang, DeliangVolume:
682
Language:
english
Journal:
Journal of Alloys and Compounds
DOI:
10.1016/j.jallcom.2016.04.321
Date:
October, 2016
File:
PDF, 1.02 MB
english, 2016