Strain measurement in micro-electronic packages using the...

Strain measurement in micro-electronic packages using the digital image correlation method

Ikeda, Toru, Kanno, Toshifumi, Shishido, Nobuyuki, Miyazaki, Noriyuki, Tanaka, Hiroyuki, Hatao, Takuya
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Volume:
25
Language:
english
Journal:
Welding International
DOI:
10.1080/09507116.2011.590654
Date:
November, 2011
File:
PDF, 608 KB
english, 2011
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