![](/img/cover-not-exists.png)
[IEEE 2015 International 3D Systems Integration Conference (3DIC) - Sendai, Japan (2015.8.31-2015.9.2)] 2015 International 3D Systems Integration Conference (3DIC) - Consideration of microbump layout for reduction of local bending stress due to CTE Mismatch in 3D IC
Kino, Hisashi, Hashiguchi, Hideto, Tanikawa, Seiya, Sugawara, Yohei, Ikegaya, Shunsuke, Fukushima, Takafumi, Koyanagi, Mitsumasa, Tanaka, TetsuYear:
2015
Language:
english
DOI:
10.1109/3dic.2015.7334596
File:
PDF, 1.03 MB
english, 2015