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Design, Modeling, Fabrication and Characterization of 2-5-μm Redistribution Layer Traces by Advanced Semiadditive Processes on Low-Cost Panel-Based Glass Interposers
Lu, Hao, Furuya, Ryuta, Sawyer, Brett M. D., Nair, Chandrasekharan, Liu, Fuhan, Sundaram, Venky, Tummala, Rao R.Year:
2016
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/TCPMT.2016.2556641
File:
PDF, 4.11 MB
english, 2016